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Modular Sensor Architecture — Open Coin-Cell IoT Hardware Standard
The Pure Engineering Modular Sensor Architecture is an open hardware and firmware specification for building multi-year coin-cell wireless sensor prototypes without custom cables or solder joints. Modules interconnect through a zero-component 62-mil PCB card edge paired with AVX 009159010061916 open-ended board-to-board sockets.
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28-Year Portfolio
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KYOCERA AVX 00-9159 datasheet ↗
Architecture & Technical Specifications
Hardware Architecture & Features
- Zero-cost 62-mil PCB card-edge tab on sensor boards mates with AVX 009159010061916 board-to-board connectors.
- 10-pin standard bus: VCC (2.0 V to 3.3 V), RAW battery (3.3 V to 15 V), GND, I2C SDA, I2C SCK, UART TX/RX GPIOs, and open-collector wake-up interrupt on Pin 10.
- Pass-through card-edge fingers allow multiple I2C and reversed-key SPI sensor boards to daisy-chain.
- Primary Core Modules: Nordic nRF52 series (BLE / Cortex-M4F) and Texas Instruments CC2650 (multi-standard 2.4 GHz).
- Recommended companion ICs: TI ADS7924 low-power I2C ADC, Semtech SX1508B I2C GPIO expander, and NXP SC16IS740 I2C-to-UART bridge.
Firmware, Software & Integration
- Supported across Zephyr RTOS, Contiki OS, and Apache Mynewt.
- Uses Protocol Buffers (nanopb) for compact schema-driven sensor payloads over BLE, MQTT, and MQTT-SN.
- Designed for sub-microamp sensor sleep states and interrupt-driven wake-up on Pin 10.
Hardware Photos & Figures (3)
Datasheets, Source Code & Reference Links
www.PUREmodules.com
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KYOCERA AVX 00-9159 datasheet
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contiki
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MQTT
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Protocol Buffers
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nanoPb
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nrf52
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cc2650
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ADS7924
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Mics 6814 sensor module
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Semtech SX1508B
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SC16IS740 datasheet
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Grid-EYE-breakout
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SI1153 Breakout
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VL53L0 Breakout
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road-map
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Google Group
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PUREmodules Ecosystem
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